pk 552 (v1.1) november 16, 2012 www.xilinx.com 1 pk 5 52 ( v 1 . 1 ) november 16 , 201 2 100% material declaration data sheet for 7 series fbg676 average weight: 2. 9376 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.388303 13.218 silicon (si) 7440- 21- 3 100.00 basis 0.388303 solder bump 0.018136 0.617 tin (sn) 7440- 31- 5 63.00 basis 0.011426 lead (pb) 7439- 92- 1 37.00 basis 0.006710 solder paste 0.003700 0.126 tin (sn) 7440- 31- 5 96.50 basis 0.003571 silver (ag) 7440- 22- 4 3.00 basis 0.000111 copper (cu) 7440- 50- 8 0.50 basis 0.000019 capacitor 1 0.010800 0.368 batio3 type 12047- 27- 7 70.60 ceramic 0.007625 nickel (ni) 7440- 02- 0 6.70 inner electrode 0.000724 copper (cu) 7440- 50- 8 20.10 outer electrode 0.002171 nickel (ni) 7440- 02- 0 0.80 plating 1 0.000086 tin (sn) 7440- 31- 5 1.80 plating 2 0.000194 capacitor 2 0.001200 0.041 batio3 type 12047- 27- 7 66.00 ceramic 0.000792 copper (cu) 7440- 50- 8 2.67 inner electrode 0.000032 nickel (ni) 7440- 02- 0 23.33 outer electrode 0.000280 nickel (ni) 7440- 02- 0 2.33 plating 1 0.000028 tin (sn) 7440- 31- 5 5.67 plating 2 0.000068 capacitor 3 0.007440 0.253 batio3 type 12047- 27- 7 51.10 ceramic 0.003802 nickel (ni) 7440- 02- 0 27.00 inner electrode 0.002009 copper (cu) 7440- 50- 8 16.0 0 outer electrode 0.001190 glass 65997- 17- 3 0.90 plating1 0.000067 nickel (ni) 7440- 02- 0 2.00 plating 1 0.000149 tin (sn) 7440- 31- 5 3.00 plating 2 0.000223 ? copyright 201 2 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet ? 7 series fbg676 pk 552 (v1.1) november 16, 2012 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total underfill 0.049000 1.668 bisphenol f/ epichlorohydrin copolymer 9003- 36- 5 20.00 basis 0.009800 phenolic resin trade secret 15.00 basis 0.007350 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.002450 amine type accelerator trade secret 5.00 basis 0.002450 silicon dioxide 60676- 86- 0 51.50 basis 0.025235 carbon black 1333- 86- 4 1.00 basis 0.000490 additives trade secret 2.50 additive 0.001225 solder ball 0.564707 19.223 tin (sn) 7440- 31- 5 96.50 main material 0.544942 silver (ag) 7440- 22- 4 3.00 main material 0.016941 copper (cu) 7440- 50- 8 0.50 main material 0.002824 substrate 1.894314 64.485 copper (cu) 7440- 50- 8 37.00 0.700896 tin (sn) 7440- 31- 5 1.67 0.031635 lead (pb) 7439- 92- 1 0.33 0.006251 silver (ag) 7440- 22- 4 0.03 0.000568 bt core n/a 49.35 0.934844 abf n/a 11.49 0.217657 solder mask n/a 0.13 0.002463
100% material declaration data sheet ? 7 series fbg676 pk 552 (v1.1) november 16, 2012 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (?contractors?). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 03/23 /2012 1.0 initial xilinx release. 11/16/2012 1.1 update substrate component
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